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Materials
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Standard
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Advanced
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Standard Features
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Standard
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Advanced
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FR4 (130-180 Tg by DSC)
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Y
|
Y
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Maximum layer count
|
20
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28
|
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Halogen Free
|
Y
|
Y
|
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Maximum Panel Size
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21"x24"
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24"x30"
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BT Epoxy
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Y
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Y
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Outer Layer Trace/Spacing (1/3 oz)
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0.0035"/0.0035"
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0.0025"/0.003"
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Getek
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Y
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Y
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[90µm/90µm]
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[64µm/76µm]
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Isola 370HR, 406, 408, IS410, IS 420, IS620
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Y
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Y
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Inner Layer Trace/Spacing (H oz)
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0.003"/0.003"
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0.002"/0.0025"
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Nelco 4000
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Y
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Y
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[76µm/76µm]
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[50µm/64µm]
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Rogers 4000
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Y
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Y
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Maximum PCB thickness
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0.125"[3.2mm]
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0.177"[4.5mm]
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PTFE
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Y
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Y
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Minimum PCB thickness
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0.008"[0.20mm]
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0.004"[0.10mm]
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Dupont Pyralux
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N
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Y
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Minimum mechancial drill size
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0.008"[0.20mm]
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0.004"[0.10mm]
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Aluminum Core
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Y
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Y
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Maximum PCB aspect ration
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10:1
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12:1
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| |
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Maximum copper weight
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5 oz [178µm]
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6 oz [214µm]
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Surface Finishes
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|
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Minimum copper weight
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1/3 oz [12µm]
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1/4 oz [9µm]
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ENIG
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Y
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Y
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Minimum core thickness
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0.002"[50µm]
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0.0015"[38µm]
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Flash Gold
|
Y
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Y
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Minimum dielectric thickness
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0.0025"[64µm]
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0.0015"[38µm]
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Electrolytic Nickel/Hard Gold
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Y
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Y
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Minimum Pad Size over Drill
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0.018"[0.46mm]
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0.016"[0.4mm]
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HASL
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Y
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Y
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Solder Mask Registration
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+/- 0.002"[50µm]
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+/- 0.0015"[38µm]
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Lead Free HASL
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Y
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Y
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Mimimum Solder Mask Dam
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0.003"[76µm]
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0.0025"[64µm]
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Immersion Ag
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Y
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Y
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Copper feature to PCB edge
|
0.015"[0.38mm]
|
0.010"[0.25mm]
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Immersion Tin
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Y
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Y
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Tolerance on overall dimensions
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+/- 0.004"[100µm]
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+/- 0.002"[50µm]
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OSP
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Y
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Y
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|
|
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Selective & Multiple Surface Finishes
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Y
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Y
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HDI Features
|
|
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Electrolytic Soft Gold
|
N
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Y
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Capture pad size
|
0.010"[0.25mm]
|
0.009"[0.22mm]
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Carbin Ink
|
Y
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Y
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Glass reinforced dielectrics
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Y
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Y
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Peelable Solder Mask / Kapton Tape
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Y
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Y
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Maximum aspect ratio
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0.6:1
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1:1
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| |
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Minimum microvia hole size
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0.004"[100µm]
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0.003"[75µm]
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PCB Technologies
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|
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Stacked Microvias
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Y
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Y
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Buried and Blind Microvias
|
Y
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Y
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Copper Filled Microvias
|
Y
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Y
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Sequential lamination
|
Y
|
Y
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Maximum No. of buildup layer
|
3+N+3
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4+N+4
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Mixed dielectric / Hybrid construction
|
Y
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Y
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|
|
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Aluminum Back PCB
|
Y
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Y
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Quality System and Certificates
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Buried Capacitance
|
N
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Y
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IPC-600, 6012, Class II and III
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PCB w/Cavity
|
N
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Y
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ISO 9001:2008
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Conductive hole fill
|
Y
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Y
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TS 14969:2009
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Non-conductive hole fill
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Y
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Y
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UL: E229342
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Countersink
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Y
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Y
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|
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Depth Control Drill and Rout
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Y
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Y
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Shenzhen Headquarters:
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Edge Milling
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Y
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Y
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B Building Shangxing No.2 Industry District, Shajing Town,
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Etch Back
|
Y
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Y
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Baoan, Shenzhen, Guangdong 518125, China
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Impedance
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+/- 10%
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+/- 5%
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Tel: +86-755-27243597 Fax: +86-755-27243642 www.sunshinepcb.com
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Scoring and PCB edge Beveling
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Y
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Y
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US Office: 3400 Silverstone Drive, Suite 139, Plano, TX 75023
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In-board Beveling
|
Y
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Y
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Tel: 972-867-8886 Fax: 972-867-8002
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