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Materials
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Standard
|
Advanced
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Standard Features
|
Standard
|
Advanced
|
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FR4 (130-180 Tg by DSC)
|
Y
|
Y
|
|
Maximum layer count
|
20
|
28
|
|
Halogen Free
|
Y
|
Y
|
|
Maximum Panel Size
|
21"x24"
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24"x30"
|
|
BT Epoxy
|
Y
|
Y
|
|
Outer Layer Trace/Spacing (1/3 oz)
|
0.0035"/0.0035"
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0.0025"/0.003"
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Getek
|
Y
|
Y
|
|
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[90µm/90µm]
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[64µm/76µm]
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|
Isola 370HR, 406, 408, IS410, IS 420, IS620
|
Y
|
Y
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Inner Layer Trace/Spacing (H oz)
|
0.003"/0.003"
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0.002"/0.0025"
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Nelco 4000
|
Y
|
Y
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|
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[76µm/76µm]
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[50µm/64µm]
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Rogers 4000
|
Y
|
Y
|
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Maximum PCB thickness
|
0.125"[3.2mm]
|
0.177"[4.5mm]
|
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PTFE
|
Y
|
Y
|
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Minimum PCB thickness
|
0.008"[0.20mm]
|
0.004"[0.10mm]
|
|
Dupont Pyralux
|
N
|
Y
|
|
Minimum mechancial drill size
|
0.008"[0.20mm]
|
0.004"[0.10mm]
|
|
Aluminum Core
|
Y
|
Y
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|
Maximum PCB aspect ration
|
10:1
|
12:1
|
| |
|
|
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Maximum copper weight
|
5 oz [178µm]
|
6 oz [214µm]
|
|
Surface Finishes
|
|
|
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Minimum copper weight
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1/3 oz [12µm]
|
1/4 oz [9µm]
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ENIG
|
Y
|
Y
|
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Minimum core thickness
|
0.002"[50µm]
|
0.0015"[38µm]
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|
Flash Gold
|
Y
|
Y
|
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Minimum dielectric thickness
|
0.0025"[64µm]
|
0.0015"[38µm]
|
|
Electrolytic Nickel/Hard Gold
|
Y
|
Y
|
|
Minimum Pad Size over Drill
|
0.018"[0.46mm]
|
0.016"[0.4mm]
|
|
HASL
|
Y
|
Y
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Solder Mask Registration
|
+/- 0.002"[50µm]
|
+/- 0.0015"[38µm]
|
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Lead Free HASL
|
Y
|
Y
|
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Mimimum Solder Mask Dam
|
0.003"[76µm]
|
0.0025"[64µm]
|
|
Immersion Ag
|
Y
|
Y
|
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Copper feature to PCB edge
|
0.015"[0.38mm]
|
0.010"[0.25mm]
|
|
Immersion Tin
|
Y
|
Y
|
|
Tolerance on overall dimensions
|
+/- 0.004"[100µm]
|
+/- 0.002"[50µm]
|
|
OSP
|
Y
|
Y
|
|
|
|
|
|
Selective & Multiple Surface Finishes
|
Y
|
Y
|
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HDI Features
|
|
|
|
Electrolytic Soft Gold
|
N
|
Y
|
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Capture pad size
|
0.010"[0.25mm]
|
0.009"[0.22mm]
|
|
Carbin Ink
|
Y
|
Y
|
|
Glass reinforced dielectrics
|
Y
|
Y
|
|
Peelable Solder Mask / Kapton Tape
|
Y
|
Y
|
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Maximum aspect ratio
|
0.6:1
|
1:1
|
| |
|
|
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Minimum microvia hole size
|
0.004"[100µm]
|
0.003"[75µm]
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|
PCB Technologies
|
|
|
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Stacked Microvias
|
Y
|
Y
|
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Buried and Blind Microvias
|
Y
|
Y
|
|
Copper Filled Microvias
|
Y
|
Y
|
|
Sequential lamination
|
Y
|
Y
|
|
Maximum No. of buildup layer
|
3+N+3
|
4+N+4
|
|
Mixed dielectric / Hybrid construction
|
Y
|
Y
|
|
|
|
|
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Aluminum Back PCB
|
Y
|
Y
|
|
Quality System and Certificates
|
|
Buried Capacitance
|
N
|
Y
|
|
IPC-600, 6012, Class II and III
|
|
PCB w/Cavity
|
N
|
Y
|
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ISO 9001:2008
|
|
Conductive hole fill
|
Y
|
Y
|
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TS 14969:2009
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|
Non-conductive hole fill
|
Y
|
Y
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UL: E229342
|
|
Countersink
|
Y
|
Y
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|
|
|
|
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Depth Control Drill and Rout
|
Y
|
Y
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Shenzhen Headquarters:
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Edge Milling
|
Y
|
Y
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B Building Shangxing No.2 Industry District, Shajing Town,
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Etch Back
|
Y
|
Y
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Baoan, Shenzhen, Guangdong 518125, China
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Impedance
|
+/- 10%
|
+/- 5%
|
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Tel: +86-755-27243597 Fax: +86-755-27243642 www.sunshinepcb.com
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Scoring and PCB edge Beveling
|
Y
|
Y
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US Office: 3400 Silverstone Drive, Suite 139, Plano, TX 75023
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|
In-board Beveling
|
Y
|
Y
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Tel: 972-867-8886 Fax: 972-867-8002
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